gc8mps- v sic mps? diode aug 2018 rev1.2 www.genesicsemi.com/schottky_mps/GC08MPS12-220. pdf page 1 of 7 silicon carbide schottky diode features package ? high avalanche (uis) capability ? enhanced surge current capability ? superior figure of merit q c /i f ? low thermal resistance ? 175 c maximum operating temperature ? temperature independent switching behavior ? positive temperature coefficient of v f ? extremely fast switching speeds to-220-2l advantages applications ? low standby power losses ? improved circuit efficiency (lower overall cost) ? low switching losses ? ease of paralleling without thermal runaway ? smaller heat sink requirements ? low reverse recovery current ? low device capacitance ? low reverse leakage current ? boost diode in power factor correction (pfc) ? switched mode power supply (smps) ? uninterruptible power supply (ups) ? motor drives ? freewheeling / anti-par allel diode in inverters ? solar inverters ? led and hid lighting ? ac-dc converters & a uxiliary power supplies absolute maximum ratings (at t c = 25 c unless otherwise stated) parameter symbol conditions values unit repetitive peak reverse voltage v rrm 1200 v continuous forward current i f t c = 25 c, d = 1 43 a t c = 135 c, d = 1 21 t c = 167 c, d = 1 8 non-repetitive peak forward surge current, half sine wave i f,sm t c = 25 c, t p = 10 ms 65 a t c = 150 c, t p = 10 ms 52 repetitive peak for ward surge current, half sine wave i f,rm t c = 25 c, t p = 10 ms 38 a t c = 150 c, t p = 10 ms 26 non-repetitive peak forward surge current i f,max t c = 25 c, t p = 10 s 610 a i 2 t value i 2 dt t c = 25 c, t p = 10 ms 21.2 a 2 s non-repetitive avalanche energy e as l = 3 mh, i as = 8 a 90 mj diode ruggedness dv/dt v r = 0 ~ 960 v 100 v/ns power dissipation p tot t c = 25 c 308 w operating an d storage temperature t j , t stg -55 to 175 c v rrm = 1200 v i f (tc = 135c) = 21 a q c = 33 nc 2 1 case
gc8mps- v sic mps? diode aug 2018 rev1.2 www.genesicsemi.com/schottky_mps/GC08MPS12-220. pdf page 2 of 7 electrical characteristics parameter symbol conditions values unit min. typ. max. diode forward voltage v f i f = 8 a, t j = 25 c 1.5 1.8 v i f = 8 a, t j = 175 c 2 2 . 4 reverse current i r v r = 1200 v, t j = 25 c 0 . 7 7 a v r = 1200 v, t j = 175 c 2.1 25.2 total capacitive charge q c i f i f,max di f /dt = 200 a/s t j = 175 c v r = 400 v 22 n c v r = 800 v 33 switching time t s v r = 400 v < 10 ns v r = 800 v total capacitance c v r = 1 v, f = 1 mhz, t j = 25 c 545 pf v r = 800 v, f = 1 mhz, t j = 25 c 4 1 thermal / mechanical characteristics thermal resistance, junction - case r thjc 0.47 c/w weight w t 2 g mounting torque t m 0 . 8 n m
gc8mps- v sic mps? diode aug 2018 rev1.2 www.genesicsemi.com/schottky_mps/GC08MPS12-220. pdf page 3 of 7 i f = f(v f ,t j ); t p = 10 s i f = f(v f ,t j ); t p = 10 s figure 1: typical forward characteristics figure 2: typical high current forward characteristics i r = f(v r ,t j ) p tot = f(t c ) figure 3: typical reverse characteristics figure 4: power derating curve
gc8mps- v sic mps? diode aug 2018 rev1.2 www.genesicsemi.com/schottky_mps/GC08MPS12-220. pdf page 4 of 7 i f = f(t c ); d = t p /t, t p = 10 s c = f(v r ); t j = 25 c; f = 1 mhz figure 5: current derating curves figure 6: typical junction capacitance vs reverse voltage characteristics q c = f(v r ); t j = 25 c; f = 1 mhz e c = f(v r ); t j = 25 c; f = 1 mhz figure 7: typical capacitive charge vs reverse voltage characteristics figure 8: typical capacitive energy vs reverse voltage characteristics
gc8mps- v sic mps? diode aug 2018 rev1.2 www.genesicsemi.com/schottky_mps/GC08MPS12-220. pdf page 5 of 7 z th,jc = f(t p ,d); d = t p /t figure 9: transient thermal impedance i f = (v f C v bi )/r diff (a) built-in voltage (v bi ): v bi (t j ) = m*t j + n (v) m = -1.55e-03, n = 1.01 differential resistance (r diff ): r diff (t j ) = a*t j 2 + b*t j + c (?); a = 1.57e-06, b = 2.62e-04, c = 0.0554 i f = f(v f , t j ) figure 10: forward curve model
gc8mps- v sic mps? diode aug 2018 rev1.2 www.genesicsemi.com/schottky_mps/GC08MPS12-220. pdf page 6 of 7 package dimensions to-220-2l package outline recommended solder pad layout note 1. controlled dimension is inch. dimension in bracket is millim eter. 2. dimensions do not include end flash, mold flash, material pr otrusions
gc8mps- v sic mps? diode copyright ? 2018 genesic semiconductor inc. all rights reserved the information in this document is subject to change without n otice published by genesic semiconductor, inc. 43670 trade center place suite 155 dulles, va 20166 aug 2018 rev1.2 page 7 of 7 rohs compliance the levels of rohs restricted materials in this product are bel ow the maximum concentration values (also referred to as the threshold limits) permitted for such substan ces, or are used in an exempted application, in accordance with eu directive 201 1/65/ec (rohs), as implemented november 15, 2017. rohs declarations for this product can be obtained from your genesic representative. reach compliance reach substances of high concern (svhcs) information is availab le for this product. since the european chemical agency (echa) has published notice of their intent to frequently revise the svhc listing for the foreseeable future, please cont act a genesic representative to insure you get the most up-to-date reach svhc declaration. reach banned substa nce information (reach article 67) is also available upon request. this product has not been designed or tested for use in, and is not intended for use in, applications implanted into the human body nor in applications in which failure of the prod uct could lead to death, personal injury or property damage, including but not limited to equipment used in the oper ation of nuclear facilities, life-support machines, cardiac defibrillators or similar emergency medical equipment, aircraft navigation or communication or control systems, or air traffic control systems. genesic disclaims all and any warranty and liability arising ou t of use or application of any product. no license, express or implied to any inte llectual property rights is grant ed by this document. related links ? soldering document: http://www. genesicsemi.com/quality/quality -manual/ ? tin-whisker report: http://www.gene sicsemi.com/quality/complia nce/ ? reliability report: http://www.gene sicsemi.com/quality/reliabi lity/
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